Process Integration Engineer – Backend & Packaging

Job title

Process Integration Engineer - Packaging

Location

Eindhoven, High Tech Campus

Hours

40 hours

Join us at SMART Photonics B.V., the heart of innovation in photonics semiconductors. As a dedicated Indium Phosphide photonics foundry, we take pride in our collaborative approach to turn our clients’ visions into reality. We are growing rapidly and are on the lookout for passionate individuals ready to shape the future of technology.

As a Process Integration Engineer (Backend & Packaging), you are essential to our success. Your role involves on bridging the frontend and backend requirements and ensuring seamless integration between wafer fabrication and packaging processes.

Responsibilities:

  • Serve as the expert on backend and packaging requirements for PICs;
  • Address and resolve technical challenges related to the vertical integration of photonic components;
  • Collaborate with external vendors and partners to ensure compatibility of our processes with external backend and packaging requirements for enhanced manufacturability;
  • Establish and maintain quality control standards for integrated photonic products with focus on backend;
  • Collaborate with our reliability team for testing and analysis to ensure long-term performance of integrated devices;
  • Lead and manage integration projects, ensuring timely delivery and adherence to specifications.

Qualification:

  • A Master’s degree or PhD in Integrated Photonics, Electrical Engineering, Materials Science, Physics, or related field;
  • 3+ years of experience in semiconductor manufacturing, with a focus on photonic integration or equivalent PhD experience;
  • Knowledge on integrated photonic devices
  • Proven experience with backend, advanced packaging, and/or reliability  of photonic devices or integrated circuits.
  • Strong understanding of frontend and backend semiconductor processes;
  • Proficiency in process development, optimization, and troubleshooting;
  • Strong communication skills to work effectively in a cross-functional team environment;
  • Familiarity with semiconductor fabrication tools and software for process design and analysis.

Integrated photonics for LiDAR

We offer:

  • A collaborative atmosphere with talented, passionate colleagues within an open culture;
  • Personalized career development, including training and coaching opportunities. Notable trainings are JePPIX courses, Green/Black Belt in DfSS and Six Sigma or Project Management;
  • For people who need a work permit, VISA and/or relocation, we are eligible to apply for the highly skilled migrant VISA. We also have a relocation package in place.
  • Unique office perks such as chair massages, fresh fruit, fitness discounts, and Lunch Walks;

 

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